Semiconductor Dry Strip System Market By System Type (Standalone Dry Strip Systems, Cluster Tool-Integrated Strip Systems); By Wafer Application (Logic Devices, Memory Devices, Power Devices, RF & Analog Devices); By Region (North America, Europe, Asia-Pacific, Latin America, Middle East & Africa); Segment Revenue Estimation, Forecast, 2024–2030

Introduction And Strategic Context

The Global Semiconductor Dry Strip System Market is positioned to expand steadily between 2024 and 2030. While exact figures vary across sources, Strategic Market Research estimates the market at approximately USD 750 million in 2024, with a projection to surpass USD 1.1 billion by 2030, reflecting a CAGR of 6.7% during the forecast period (inferred).

 

At its core, dry strip technology is a plasma-based process used to remove photoresist and residues after etching or ion implantation. Unlike wet chemical stripping, dry strip systems deliver cleaner surfaces, lower chemical waste, and tighter process control—making them vital in advanced semiconductor fabs where every nanometer counts.

 

Why does this market matter now? Because the industry is moving to increasingly smaller nodes—sub-5nm, even looking at 3nm and beyond. At these scales, defect tolerance is near zero. Traditional wet stripping risks ionic contamination, line edge roughness, and material compatibility issues. Dry strip systems offer a non-invasive, residue-free alternative that aligns with next-gen requirements for logic, memory, and power devices.

 

Several macro forces are converging to fuel adoption:

• Technology scaling pressure : Shrinking transistor geometries demand precision cleaning and stripping steps.

• Regulatory and environmental push : Chemical waste reduction has become a compliance and sustainability imperative.

• Fab expansion in Asia : China, Taiwan, South Korea, and India are building new fabs that need state-of-the-art stripping tools.

• Rise of compound semiconductors : GaN and SiC power devices require specialized stripping processes, opening new application avenues.

 

The stakeholder map is broad. OEMs like Tokyo Electron, Lam Research, and Screen Semiconductor Solutions are refining dry strip technologies for both silicon and compound semiconductors. Foundries and IDMs (TSMC, Samsung, Intel ) are deploying advanced strip systems to safeguard yields. Governments in Asia, the U.S., and Europe are investing in domestic chipmaking capacity, indirectly driving equipment demand. And investors are eyeing this space as a critical enabler of the semiconductor supply chain.

 

To be honest, dry strip systems were once considered a small step in the wafer process chain. Today, they’re a bottleneck in yield improvement. Without reliable stripping, advanced lithography and etching investments can’t deliver returns. In that sense, this market has evolved from a back-end utility to a front-line enabler of Moore’s Law continuity.

 

Market Segmentation And Forecast Scope

The semiconductor dry strip system market is structured around three key dimensions: By System Type, By Wafer Application, and By Region. This segmentation reflects how fabs approach capital equipment purchases based on process node complexity, material compatibility, and throughput needs.

By System Type

This category defines how dry strip systems are configured and integrated into the fab environment.

• Standalone Dry Strip Systems
  These are floor-mounted, single-function tools primarily used in batch or inline setups. They're widely used in mature process nodes where performance demands are moderate, but reliability and cost efficiency are essential.

• Cluster Tool-Integrated Strip Systems
  These are integrated into a larger process chamber cluster, typically paired with etch or deposition steps. They dominate the advanced node segment (sub-10nm), where contamination control and process flow efficiency are non-negotiable.

Integrated systems currently hold the majority share (around 62% in 2024 , inferred), given their alignment with next-gen logic and memory fabs .

 

By Wafer Application

Dry strip tools are deployed across various wafer-level processes, depending on the end-device architecture.

• Logic Devices
  CPUs, GPUs, and SoCs for consumer electronics and servers. These demand high-precision strip with zero material loss, particularly at FinFET and GAA nodes.

• Memory Devices
  DRAM and NAND production involves multiple strip steps post-etch and implant. 3D NAND, with its vertical architecture, presents unique challenges for residue removal.

• Power Devices (Si, GaN , SiC)
  As EVs and industrial automation grow, so does demand for wide-bandgap materials. These devices require highly selective and low-damage stripping techniques.

• RF & Analog Devices
  RF front-end modules and analog ICs use compound semiconductors. Stripping in these areas must manage heterogeneous material stacks.

Logic devices are currently the largest segment, driven by intense fab activity at 5nm and 3nm nodes.

 

By Region

The regional landscape is driven by fab investments, supply chain reshoring, and export control dynamics.

• Asia Pacific
  The heart of semiconductor manufacturing. Taiwan (TSMC), South Korea (Samsung), and China (SMIC, YMTC) are the key demand centers. Japan is a major supplier of dry strip tools.

• North America
  U.S. fabs (Intel, GlobalFoundries, TSMC Arizona) are retooling with dry strip systems amid CHIPS Act funding. Equipment makers like Lam Research are headquartered here.

• Europe
  Home to specialty and automotive IC fabs. Germany and France are investing in fab modernization and cleanroom expansions.

• Rest of World (Middle East, Southeast Asia)
  Malaysia, Singapore, and the UAE are building or expanding semiconductor hubs, mostly around OSATs and niche foundries.

Asia Pacific dominates the market with over 70% share in 2024 (inferred), due to its sheer fab density and capital expenditure pipeline.

 

Scope Note : The segmentation isn’t just technical—it’s strategic. Integrated systems are winning because they de-risk yield loss in increasingly fragile wafers. Power and RF devices are pushing vendors to tailor strip chemistries for exotic substrates. And regional diversification is putting pressure on vendors to scale service models globally.

 

Market Trends And Innovation Landscape

The semiconductor dry strip system market is evolving fast — and not just to keep up with shrinking nodes. What was once a basic resist-removal step has become a critical gatekeeper for yield, surface integrity, and process uniformity. Over the next few years, several innovation vectors will define how vendors compete and how fabs deploy.

1. Move Toward Low-Damage Plasma Chemistries

As transistors become smaller and more complex ( FinFET → GAA → CFET), there's zero room for surface damage or plasma-induced stress.

Vendors are now prioritizing:

• Remote plasma sources that reduce direct wafer exposure

• Low-k dielectric-friendly chemistries

• Ion-free strip processes for ultra-thin metal layers

One materials engineer at a South Korean fab said, “It’s not about just cleaning anymore. It’s about not breaking what’s underneath.”

This shift is opening up demand for R&D-intensive strip modules, often customized per fab or per process.

 

2. Integration with Atomic-Level Process Control

As dry strip moves closer to atomic-level etch-back and surface conditioning, systems are being designed to:

• Monitor etch uniformity in real time

• Adjust plasma parameters dynamically

• Interface directly with process control software and AI-driven yield monitoring

Expect future systems to integrate endpoint detection and in-situ metrology — not just for productivity, but for yield predictability.

 

3. Support for Compound Semiconductor Wafers

GaN, SiC, and even emerging materials like Ga2O 3 require tailored stripping approaches. These materials are sensitive to:

• Charge damage

• Ion bombardment

• Selectivity loss between multi-layer stacks

Tool makers are now building multi-recipe, substrate-aware dry strip platforms, capable of automatically switching between Si and wide-bandgap wafers. This trend is especially relevant in power and RF device fabs catering to EVs, 5G, and industrial automation.

 

4. Rise of Modular and Hybrid Platforms

There’s growing demand for modular strip systems that can be configured as:

• Standalone batch tools

• Clustered inline systems

• Retrofit modules for existing etch or clean tools

This is helping fabs balance cost vs. performance across legacy and advanced nodes. Some vendors are also offering hybrid strip-clean platforms with pre/post-clean built in — especially attractive in high-mix, mid-volume fabs .

 

5. Vendor Collaborations with Foundries and IDMs

Dry strip R&D is increasingly collaborative. Leading foundries now co-develop strip recipes with OEMs to match advanced node rollouts. Notable trends include:

• Strategic partnerships between U.S. toolmakers and Asian fabs

• Joint IP development for plasma source design

• Closed-loop process feedback systems shared across fab and tool layers

These collaborations speed up ramp time for 3nm and 2nm nodes — and create lock-in advantages for tool vendors who deliver both tech and trust.

 

6. Software-Defined Plasma Control & AI Optimization

This is still early, but some next-gen systems use machine learning models to:

• Predict stripping performance by wafer history

• Auto-tune plasma uniformity across lots

• Flag anomalies before physical defects occur

The long-term vision? Closed-loop dry strip, wh ere the system self-calibrates between lots or even within a single wafer batch.

 

Bottom line : Dry strip innovation is no longer just about getting rid of resist. It's about protecting surfaces, preserving material integrity, and predicting yield loss before it happens. Tool vendors that offer atomic-level precision with digital control are likely to define the competitive frontier over the next five years.

 

Competitive Intelligence And Benchmarking

The semiconductor dry strip system market is highly consolidated, with a few dominant players supplying to Tier 1 fabs globally. Unlike broader wafer processing segments where dozens of vendors compete, this space favors those with deep process engineering capabilities, long-term fab relationships, and the ability to deliver customized plasma solutions at scale.

Lam Research

Lam is arguably the most entrenched dry strip system vendor worldwide. Its Aura® series is used across logic, memory, and advanced packaging lines. The company’s strength lies in:

• Remote plasma technology to minimize wafer damage

• Tight integration with etch systems for cluster setups

• A large installed base in North America and Asia

Lam has also invested heavily in AI-driven process optimization, allowing its tools to self-calibrate strip parameters based on historical wafer data. This is especially critical for fabs operating at 5nm and below.

Lam’s differentiation isn’t price — it’s process fidelity. Fabs trust them to get things right at atomic layers.

 

Tokyo Electron (TEL)

TEL holds a strong position in Asia-Pacific and is the preferred vendor for many Japanese and Taiwanese fabs. Their Trias ™ series offers high throughput, low-damage strip using proprietary plasma source tech.

Key strengths include:

• Long-standing relationships with TSMC and Renesas

• Flexibility to support both silicon and GaN / SiC wafers

• Consistent upgrades to reduce mean time between failures (MTBF)

TEL is doubling down on modular strip-clean hybrid tools as fabs look to consolidate tool footprints. This is gaining traction in space-constrained 300mm fabs .

 

SCREEN Semiconductor Solutions

Based in Japan, SCREEN is a rising contender, particularly in batch-type dry strip systems for mature nodes and specialty devices.

They stand out for:

• High reliability tools used in high-mix/low-volume fabs

• Increasing presence in power and analog IC fabs

• Targeting cost-sensitive fabs in Southeast Asia and China

Their strategy is volume-based, not innovation-led — but they’re beginning to expand their R&D for compound semiconductor support.

 

PSK Inc.

A Korean manufacturer, PSK focuses primarily on low-damage strip systems for memory applications. Their dry strip platforms are installed in several Samsung and SK Hynix lines.

What they offer:

• Strong price-performance ratio

• Support for massive 3D NAND layer counts

• High service responsiveness in Korea and China

While PSK doesn’t lead globally, they are a preferred vendor in DRAM and NAND production and are gaining traction in mid-tier Chinese fabs .

 

NAURA Technology Group

One of China’s national champions, NAURA is scaling rapidly in response to U.S. export restrictions. It has introduced domestically-developed dry strip tools aimed at replacing U.S. and Japanese imports.

Core attributes:

• Strong government support

• Deployment in mature-node fabs and test lines

• Rapid iteration cycles through joint university labs

While not yet competitive at sub-5nm, NAURA is building capabilities for 14nm and above — critical for China’s self-sufficiency push.

 

Competitive Dynamics at a Glance

Vendor	Core Strength	Key Markets	Strategic Edge
Lam Research	Advanced node support, AI optimization	U.S., Korea, Taiwan	Premium performance, fab integration
Tokyo Electron	Flexible integration, hybrid tools	Japan, Taiwan, Southeast Asia	Close OEM-fab R&D ties
SCREEN	Batch systems, cost-efficient installs	Japan, Southeast Asia	Specialty device focus
PSK	Memory-centric tools, pricing advantage	Korea, China	Deep penetration in 3D NAND
NAURA	National substitution, low node focus	China	Government alignment

 

To be honest : The game here isn’t about who builds the most tools — it’s about who can keep pace with the fabs pushing into 3nm, GAA, and chiplet architectures. Winning vendors are those embedded in the process development lifecycle, not just on the fab floor. And as geopolitical friction reshapes fab geography, local partnerships and regionalized support models are becoming just as important as plasma physics.

 

Regional Landscape And Adoption Outlook

The semiconductor dry strip system market isn’t growing uniformly — it’s being shaped by a mosaic of regional investments, export controls, and national strategies to boost chip self-sufficiency. What matters in North America isn’t necessarily what matters in Southeast Asia or Europe. The adoption curve is directly linked to fab maturity, process node migration, and tool vendor proximity.

Asia Pacific —

No surprises here — Asia Pacific dominates the market, both in terms of demand and installed capacity. Countries like Taiwan, South Korea, China, and Japan are at the center of the semiconductor supply chain.

• Taiwan (TSMC) : Dry strip tools are deployed aggressively across 5nm and 3nm lines. Cluster-integrated systems dominate here, with a preference for high-throughput, low-contamination platforms.

• South Korea (Samsung, SK Hynix) : High-density DRAM and 3D NAND production drive demand for dry strip in vertical memory structures. Vendors like Lam and PSK have entrenched supply relationships.

• China : Facing growing restrictions on importing U.S.-made tools, Chinese fabs are rapidly turning to domestic dry strip vendors like NAURA — especially at 28nm, 14nm, and above. However, foreign vendors still dominate where allowed.

• Japan : While no longer dominant in front-end fabs, Japan is a powerhouse in equipment manufacturing. SCREEN, TEL, and Canon Tokki continue to ship tools across the region.

Asia accounts for over 70% of global dry strip installations (inferred), primarily due to sheer fab density and aggressive capital expenditure cycles.

 

North America — Strategically Rebuilding

The U.S. is re-investing in its semiconductor ecosystem after decades of offshoring. The CHIPS Act has triggered a new wave of fab construction across states like Arizona, Texas, and New York.

• Intel’s upcoming 2nm node fabs will rely heavily on cluster-integrated dry strip systems.

• TSMC’s Arizona site is expected to follow a similar tooling profile to Taiwan, meaning vendors with deep process integration — like Lam — are already locked in.

• Foundries in North America are prioritizing AI-optimized process control, favoring vendors who offer software-defined plasma and endpoint detection.

That said, total fab capacity here is still small compared to Asia — but it’s growing.

 

Europe — Focus on Specialty & Power Devices

Europe’s fab landscape leans toward automotive, power electronics, and analog/mixed-signal devices .

• Countries like Germany, France, and the Netherlands are investing in 300mm fabs, many targeting SiC and GaN substrates for EVs and industrial automation.

• Dry strip adoption here is highly targeted: vendors offering multi-substrate support and low-defect rates for wide-bandgap materials are preferred.

• The EU Chips Act aims to double Europe’s share of global chip production by 2030 — a move that will likely fuel dry strip demand in both R&D and volume fabs .

 

LAMEA (Latin America, Middle East & Africa) — Early Stage, But Watching Closely

This region is still in the infancy of semiconductor production, but strategic moves are underway:

• United Arab Emirates and Saudi Arabia are exploring semiconductor foundry investments under national diversification plans. Dry strip demand here is still limited to pilot lines and academic labs.

• Brazil has government-backed chip programs focused on analog ICs and embedded systems. These may eventually need basic dry strip capabilities, especially for niche packaging and post-process clean.

• In Africa, no meaningful fab infrastructure exists yet.

Realistically, LAMEA represents less than 5% of current demand — but future demand could emerge if localization trends take hold.

 

Regional White Space Opportunities

• Southeast Asia (Malaysia, Vietnam, Singapore ) is becoming a back-end and OSAT hub. While not yet a front-end leader, fabs are beginning to onshore more mid-node wafer production, which will require cost-effective dry strip tools.

• India has announced multiple fab projects in partnership with foreign players. The real test will be whether these materialize with advanced nodes — if they do, dry strip vendors will find a new frontier.

 

Bottom line : Where fabs go, dry strip demand follows. But not all regions are asking for the same thing. Some need cutting-edge GAA-ready systems. Others just want reliable, cost-managed strip tools for 28nm. The market winners will be those that can flex across geographies — both in technology and service models.

 

End-User Dynamics And Use Case

In the semiconductor dry strip system market, the end user is not just a buyer — they’re often a co-developer. From high-volume logic foundries to niche analog fabs, each user group has a different tolerance for contamination, downtime, and tool integration complexity. Understanding these differences is key to decoding where and how demand is concentrated.

1. Logic Foundries (e.g., TSMC, Samsung, Intel)

These fabs operate at the bleeding edge — 5nm, 3nm, and soon 2nm. Every resist residue, plasma over-strip, or surface defect is a potential yield killer.

• Dry strip systems here are fully integrated into cluster platforms alongside etch or deposition tools.

• Tools must support real-time endpoint detection, plasma tuning, and tight recipe matching across multi-chamber setups.

• There’s no room for generic systems — each configuration is fine-tuned by device type, node, and layer.

One process engineer from a major U.S. fab noted: “We treat dry strip as a precision step, not a cleaning step. It’s a yield enabler.”

These users drive most of the premium demand and prefer suppliers like Lam Research or Tokyo Electron, who can co-engineer with their process teams .

 

2. Memory Fabs (e.g., SK Hynix, Micron, YMTC)

Dry strip in memory fabs serves a slightly different purpose — primarily for repeated photoresist removal in stacked layers of 3D NAND or advanced DRAM.

• The focus here is on repeatability and throughput rather than extreme process customization.

• Strip damage must be minimal — especially when layers exceed 200+ stacks in 3D NAND.

Vendors like PSK and SCREEN have a stronghold here due to their ability to offer low-damage plasma at scale and cost-competitive batch tools .

 

3. Power & RF Device Fabs (e.g., STMicro , Wolfspeed , Qorvo)

These fabs deal with SiC, GaN, and other compound semiconductors, where dry strip must manage:

• Fragile substrate interfaces

• Metal stack selectivity

• Ion-free or remote plasma conditions

What they need most is substrate-aware stripping — systems that can switch modes or recipes based on material type. Adoption is growing as EV and 5G demand rises, but these fabs often face capital constraints.

Vendors that offer hybrid systems with modular capability (e.g., SCREEN, TEL ) are winning business in this segment.

 

4. R&D and Pilot Line Facilities

This includes government labs, research universities, and early-stage foundries. Their dry strip needs are:

• Highly flexible

• Easy to configure and reprogram

• Able to support multiple wafer types (200mm/300mm, silicon/ GaN ) in one tool

Volume isn’t high, but influence is. Many pilot projects directly inform purchasing decisions at scale later. Vendors often use this segment for early adoption pilots of new plasma chemistries or process control features.

 

5. OSATs and Mid-Node Foundries (e.g., UMC, GlobalFoundries , Tower Semiconductor)

While not at the leading edge, these players are critical for the 28nm–65nm segment, still heavily used in automotive and IoT applications.

• Their focus is cost-performance balance.

• They prefer standalone dry strip systems or batch models with low maintenance overhead .

• Vendors like SCREEN and NAURA are increasingly targeting these fabs in Asia and Eastern Europe.

 

Use Case Highlight

A major logic foundry in Taiwan was ramping a new 3nm FinFET line, and facing inconsistent strip outcomes at the post-implant stage. Despite best-in-class etch performance, downstream yield losses were rising.

The fab installed a cluster-integrated dry strip module with real-time plasma tuning and AI-based defect prediction. Within three quarters:

• Strip-induced defect density dropped by 45%

• The number of reworked wafers reduced by 30%

• Time-to-yield improved by nearly 2 weeks during initial ramp

This wasn’t just a tooling upgrade. It was a process shift — one that saved millions in wafer losses and cycle time.

 

Bottom line : End users don’t just want tools — they want predictable outcomes . Whether it’s 3nm logic, 3D NAND, or SiC power devices, the best dry strip systems are those that adapt to context — not just specifications. And the vendors who understand those nuances are the ones capturing share.

 

Recent Developments + Opportunities & Restraints

Recent Developments (2023–2025)

• Lam Research introduced an AI-integrated upgrade to its dry strip platform in early 2024, allowing real-time adjustment of plasma exposure based on wafer topology. This feature is now being tested in sub-3nm process lines at select customer sites in Taiwan and the U.S.

• Tokyo Electron (TEL) announced a multi-year collaboration with imec in Belgium to co-develop low-damage dry strip technologies tailored for gate-all-around (GAA) transistor architectures. The partnership focuses on defect reduction and selective strip in multilayer logic stacks.

• SCREEN Semiconductor released a new batch dry strip system optimized for 200mm and 300mm power devices. The system features recipe preloading for Si, GaN , and SiC substrates and is now shipping to fabs in Malaysia and Japan.

• NAURA Technology Group launched its second-generation plasma dry strip platform designed for China’s domestic 14nm and 28nm lines. The company reported an increase in install base across local foundries and research labs in Q2 2025.

• PSK unveiled a high-throughput memory-focused strip tool for advanced 3D NAND layers exceeding 256 stacks. The system uses remote plasma and inline contamination control modules, and it’s being deployed at several fabs in South Korea.

 

Opportunities

• Integration with Next-Gen Nodes (2nm and GAA)
  As logic architectures shift toward gate-all-around and beyond, the need for damage-free and selective strip steps is increasing. Dry strip vendors that offer node-specific process kits will gain an edge, especially at TSMC, Intel, and Samsung.

• Rise of Wide-Bandgap Semiconductors
  The global expansion of electric vehicles and industrial automation is driving adoption of SiC and GaN devices . Dry strip systems tailored to handle these materials — without degrading their surface or oxide layers — are a key emerging opportunity.

• Domestic Fab Buildouts in China, India, and the U.S
  Government-backed fab programs are creating demand for regionally localized strip systems . Vendors that can deliver high-quality tools with localized service and pricing flexibility are best positioned to win early orders in these growing geographies.

 

Restraints

• High Capital Cost of Advanced Tools
  Dry strip systems — particularly cluster-integrated platforms — can cost millions per unit. For many mid-tier fabs and analog players, this price tag remains a barrier. Vendors may need to offer modular or stripped-down variants for cost-sensitive buyers.

• Shortage of Skilled Plasma Process Engineers
  Even when tools are installed, running them at optimal plasma chemistry requires expertise. The global shortage of semiconductor talent , particularly in process engineering and plasma modeling, can delay tool qualification or limit performance.

 

To be honest: There’s no shortage of demand for dry strip technology — especially as fabs hit material and structural limits at sub-5nm. But execution risks remain. Vendors who can simplify tool complexity , offer global service , and align with regional industrial policy will move faster than those who focus only on hardware innovation.

 

7.1. Report Coverage Table

Report Attribute	Details
Forecast Period	2024 – 2030
Market Size Value in 2024	USD 750 Million
Revenue Forecast in 2030	USD 1.1 Billion
Overall Growth Rate	CAGR of 6.7% (2024 – 2030)
Base Year for Estimation	2024
Historical Data	2019 – 2023
Unit	USD Million, CAGR (2024 – 2030)
Segmentation	By System Type, By Wafer Application, By Region
By System Type	Standalone Dry Strip Systems, Cluster Tool-Integrated Strip Systems
By Wafer Application	Logic Devices, Memory Devices, Power Devices, RF & Analog Devices
By Region	North America, Europe, Asia-Pacific, Latin America, Middle East & Africa
Country Scope	U.S., Germany, Taiwan, China, Japan, South Korea, India, Brazil, etc.
Market Drivers	- Migration to sub-5nm nodes requiring damage-free processing - Rise of compound semiconductors (SiC, GaN) in power and RF - Fab expansion in Asia and the U.S. under industrial policy funding
Customization Option	Available upon request