Electronic Adhesives Market By Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Others); By Form (Liquid, Paste, Film, Pellet); By Resin Type (Epoxy, Silicone, Polyurethane, Acrylic, Others); By Application (Surface Mount Devices (SMDs), Conformal Coatings, Encapsulation, Potting and Coating, Others); By Geography, Segment Revenue Estimation, Forecast, 2024–2032.

Electronic Adhesives Market Size & Overview

The Global Electronic Adhesives Market was valued at USD 6.4 billion in 2024 and is projected to reach USD 9.6 billion by 2030, growing at a CAGR of 7.1%. The market is driven by the growing demand for miniaturized and lightweight electronic devices.

 

Electronic Adhesives Market Dynamics:

Market Drivers

Adhesives are essential across various industries, including automotive manufacturing, packaging, electronics, solar energy & construction, serving as a fundamental component of a thriving $50 billion market. The consumer electronics market is anticipated to experience accelerated growth in the coming years. In 2025, its total revenue is projected to rise by 3% to $978 billion, with further expansion expected in 2026 surpassing the $1 trillion mark for the first time. In the automotive sector, the shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS) is significantly boosting the use of electronic adhesives in battery assemblies, sensors, and control modules. In 2023, electric car sales surged by 3.5 Mn compared to 2022, marking a substantial 35% year-on-year growth. This increase is over six times greater than the sales recorded in 2018, just five years prior. Additionally, the proliferation of 5G technology, IoT devices & wearable electronics is creating a surge in demand for reliable and durable adhesive solutions. As electronic devices become smaller & wearable technology diversifies, the use of resin components and film-like materials is steadily increasing.

 

Market Restraints

One significant challenge is the high cost of advanced adhesive formulations, particularly those offering specialized properties such as superior thermal and electrical performance. These premium adhesives often come with a higher price tag, making them less accessible for small manufacturers & potentially limiting widespread adoption. Stringent environmental regulations pose hurdles, as governments worldwide impose strict standards on the use of certain chemicals in adhesives. The U.S. Environmental Protection Agency has established updated risk management regulations for two hazardous chemicals, trichloroethylene (TCE) & perchloroethylene (PCE), commonly used in adhesives. These new rules are designed to minimize exposure to these toxic substances, which have been associated with serious health risks, including cancer, neurotoxicity & reproductive harm. Compliance with these regulations can lead to increased costs and longer development timelines, deterring some companies from entering the market or expanding their product lines.

 

Market Opportunities

The renewable energy sector, particularly solar and wind energy, is bolstering the market growth. In solar energy systems, adhesives are essential for bonding photovoltaic cells and ensuring their durability under harsh environmental conditions. Epic Resins focuses on developing custom-formulated adhesives engineered for exceptional adhesion to photovoltaic cells. Silicone adhesives and sealants are well known for their exceptional durability and extended lifespan. They offer remarkable resistance to UV radiation, extreme temperatures, and environmental wear. There is a growing trend towards developing eco-friendly & sustainable adhesives. Manufacturers are focusing on creating adhesives with low volatile organic compound (VOC) emissions, recyclable or biodegradable properties, and compliance with environmental regulations.

 

Electronic Adhesives Market: Recent Developments

• On April 30, 2025, Ellsworth Adhesives, a worldwide distributor specializing in adhesives, specialty chemicals, and dispensing equipment, announced its collaboration with 3M to meet the rising demand for 3M™ Scotch-Weld™ One-Part Epoxy Adhesives 6101 and 6102. These cutting-edge bonding & sealing solutions aim to enhance electronic design capabilities & boost manufacturing efficiency across the globe.

 

• On February 25, 2025, LG Chem revealed its partnership with HL Mando, a prominent Korean automotive parts manufacturer, to jointly develop adhesives for electronic components in vehicles. This collaboration is part of LG Chem's strategy to strengthen its foothold in the automotive adhesive industry.

 

• On May 20, 2024, H.B. Fuller, a St. Paul, MN-based adhesives manufacturer, acquired ND Industries, a provider of specialty adhesives and fastener locking and sealing solutions. This acquisition aims to enhance H.B. Fuller's adhesive application expertise & accelerate its growth strategy.

 

Electronic Adhesives Market Segmentation: A Comprehensive Overview

By Product Type

• Electrically Conductive Adhesives

• Thermally Conductive Adhesives

• UV Curing Adhesives

• Others

 

By Form

• Liquid

• Paste

• Film

• Pellet

 

 By Resin Type

• Epoxy

• Silicone

• Polyurethane

• Acrylic

• Others

 

By Application

• Surface Mount Devices (SMDs)

• Conformal Coatings

• Encapsulation

• Potting and Coating

• Others

 

By Region

• North America

• Europe

• Asia Pacific

• Latin America

• Middle East & Africa

 

Segmentation Analysis – Electronic Adhesives Market

By Product Type:

Electrically Conductive Adhesives: Lead the market due to growing demand in EVs and solar electronics. Panacol, a Germany-based adhesive technology provider, has introduced Elecolit 3648, a conductive adhesive designed for creating flexible electrical connections on temperature-sensitive organic photovoltaic (OPV) and perovskite solar devices. Scientists at the International Solar Energy Research Center Konstanz (ISC Konstanz) in Germany have introduced an innovative technique for assessing the contact resistance in solar cell interconnections that utilize electrically conductive adhesives (ECAs).

Thermally Conductive Adhesives: Fastest-growing segment, driven by miniaturization and heat management needs. On August 9, 2023, G6 Materials Corp., a technology-driven company specializing in advanced materials and innovative composites for various industrial applications, announced the launch of its new thermally conductive G6-EPOXY® product line.

UV Curing Adhesives: Gaining traction for their fast processing and suitability for delicate components. UV-curable polymers, functioning as adhesives, are gaining popularity in the large-scale manufacturing of micro & nanoscale optical components through nanoimprint lithography. Their key attributes include a well-matched refractive index, high optical transmission, stable thermo-mechanical properties, and outstanding overall reliability.

 

By Form:

Liquid: Most commonly used due to ease of application and versatility. ARcare® UV-curable liquid adhesives are engineered to bond effectively with a diverse range of plastic and metal substrates. This patented adhesive technology guarantees biocompatibility while enabling the fast and efficient assembly of medical sensors and wearable devices.

Paste: Preferred for thicker applications & gap-filling purposes. Henkel has created a versatile range of die attach pastes tailored to diverse wirebond needs, including smaller die-to-pad ratios, high-temperature resilience, low stress, and strong adhesion.

Film: Offers precise application and uniform thickness, ideal for high-end electronics. Adhesive films, like M&Ms candy shells, stabilize materials for convenient use. They are easier to store and handle, require less cleanup, & offer increased efficiency in production processes, especially in electronics manufacturing where precision and cleanliness are vital. While they may cost more per unit area than liquid adhesives, their benefits often outweigh the additional cost in terms of process efficiency and product quality.

Pellet: Hot melt adhesive pellets and sticks are extensively utilized for positioning, bonding, and sealing electrical components. They also play a crucial role in low-pressure molding processes, ensuring the protection of electric wires & cables.

 

By Resin Type:

Epoxy adhesives dominate the market due to their excellent mechanical strength, chemical resistance, and strong adhesion properties. They are widely used in high-performance electronic applications such as encapsulation, potting, and surface mount devices.

Silicone adhesives are preferred for applications that require flexibility and thermal stability, especially in environments with high temperature fluctuations, such as automotive and industrial electronics. Silicone thermal adhesives are commonly used in smartphone chargers, which generate heat rapidly. For cable connectors, bonding and sealing can incorporate primer-less adhesion with instant green strength, ensuring strong adhesion and easy reworkability, reducing waste in the process.

Polyurethane adhesives are valued for their durability, impact resistance, and ability to perform well under dynamic stress, making them suitable for both industrial and consumer electronics.

Acrylic adhesive has been a reliable industry standard for years, valued for its durability & resilience in demanding environments, including high temperatures & chemical exposure. As a resin-based adhesive, this synthetic polymer compound is highly sought after for its rapid bonding capability & long-lasting strength, even in challenging applications.

The Others category includes specialty resins like polyimides and cyanate esters, which are used in niche applications requiring extreme thermal or chemical performance.

 

By Application:

Surface Mount Devices (SMDs) represent the largest application segment, driven by the global trend toward miniaturization in consumer electronics, where adhesives are essential for bonding components to printed circuit boards with high precision & durability.  Surface Mount Adhesives (SMAs) are essential in electronics manufacturing, enabling the precise assembly of printed circuit boards (PCBs) & electronic components. Their growing popularity stems from their capacity to improve production efficiency while ensuring strong mechanical & electrical connections.

Conformal Coatings are used to protect electronic circuits from moisture, dust, chemicals & temperature extremes, ensuring long-term functionality in harsh environments such as automotive and aerospace. Whether silicone or parylene-based, these specialized protective coatings enhance the reliability of PCB conformal coatings in UAVs, autonomous ground vehicles, and maritime robotics.

Encapsulation involves enclosing sensitive components in adhesive materials to shield them from mechanical stress, vibration, and environmental damage, which is especially important in industrial and outdoor electronics. Electronics encapsulation epoxy adhesive is a resin-based solution designed for secure bonding and protection of electronic components. Unlike conventional adhesives, it forms a durable encapsulating layer around electronic parts, shielding them from environmental hazards.

Potting and Coating offer similar protective benefits by filling and sealing electronic assemblies to prevent corrosion and short-circuiting, commonly used in power electronics and LED systems.

The Others category includes secondary applications like wire tacking and underfill, which support overall device integrity and performance.

 

By Region:

Asia Pacific holds the largest share of the market, driven by rapid industrialization, strong consumer electronics manufacturing hubs in China, Japan, South Korea, and Taiwan, and increasing investments in electric vehicles and 5G infrastructure. Asia plays a crucial role in the global electronics market, contributing significantly to the production, distribution & sales of various electronic products. According to the United Nations Conference on Trade & Development, the region is responsible for manufacturing over 50% of the world's electronics. Asian companies have driven technological advancements in the electronics industry through substantial investments in R&D. China has heavily invested in AI technologies, while South Korea has focused on expanding its 5G telecommunications networks.

North America follows with significant demand fueled by technological innovation, rising adoption of electric vehicles, and the presence of key electronics and semiconductor companies in the U.S. As part of the extensive International Organization for Standardization (ISO) standards, ISO 16525-1:2014 defines general test methods for isotropic electrically conductive adhesives used in wiring, semiconductor die attachment & PCB surface assembly. This standard establishes various assessment methods to evaluate the performance & reliability of these adhesives, ensuring their effectiveness in critical applications.

Europe is also a major market, supported by strong automotive electronics demand, strict environmental regulations & initiatives promoting sustainable & advanced manufacturing technologies. Adhesives & sealants provide advantages to businesses, consumers, and the environment, supporting the principles of the circular economy. The proposed EU Ecodesign Regulation is particularly relevant to these materials, as it introduces new regulatory standards for products in which adhesives and sealants play a crucial role.

Latin America shows growing potential, particularly in consumer electronics and telecommunications, as the region experiences gradual technological adoption and infrastructure expansion.

Middle East & Africa represents an emerging market, with increasing investments in industrial automation and electronics manufacturing, though growth is currently slower compared to other regions.

 

Key Players in the Electronic Adhesives Market

• Henkel AG & Co. KGaA

• H.B. Fuller Company

• 3M Company

• Dow Inc.

• Arkema S.A.

• BASF SE

• Pidilite Industries Ltd.

• Sika AG

• Evonik Industries AG

• Dymax Corporation

 

Electronic Adhesives Market Report Coverage

Report Attribute	Details
Forecast Period	2024 – 2032
Market Size Value in 2024	USD 6.4 Billion
Revenue Forecast by 2030	USD 9.6 Billion
Overall Growth Rate	CAGR of 7.1% (2024 – 2030)
Base Year for Estimation	2023
Historical Data	2017 – 2021
Unit	USD Billion, CAGR (2024 – 2030)
Segmentation	By Product Type, By Form, By Resin Type, By Application, By Geography
By Product Type	Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Others
By Form	Liquid, Paste, Film, Pellet
By Resin Type	Epoxy, Silicone, Polyurethane, Acrylic, Others
By Application	Surface Mount Devices (SMDs), Conformal Coatings, Encapsulation, Potting and Coating, Others
By Region	North America, Europe, Asia-Pacific, Latin America, Middle East & Africa
Country Scope	U.S., Germany, China, Japan, India, South Korea, UK, Brazil, etc.
Market Drivers	Expansion of consumer electronics, demand for miniaturized devices, growth in automotive electronics sector
Customization Option	Available upon request